Materials and Assembly Lab
for Energy and Environmental Applications

Materials for thermal management

Heat-dissipating and heat-generating materials are designed. Developments of high-performance thermal interface materials (TIM) and new packing materials for underfill are the top priority of the semiconductor industry. We are developing highly thermal conductive TIMs and underfill materials using our carbon-based nanomaterials and polymers. In addition, we are studying highly efficient heating elements for space, military, and automobile purposes. High-efficient heating is critical for energy-saving strategies in these areas.